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La série MagicRay 3D SPI-VSP3000 est adaptée à l'inspection 3D de la pâte de soudure après l'impression sur écran SMT

Machines de cueillette et de placement SMT
June 04, 2025
Catégorie Connexion: Machine de placement SMT
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Balises:
#Imprimante à écran SMT #Machine de sélection et de placement SMT #Équipement de placement SMT
Bref: Discover the MagicRay 3D SPI-VSP3000 Series, the ultimate solution for 3D solder paste inspection after SMT screen printing. This advanced system ensures precision and quality in PCB manufacturing with cutting-edge technology.
Caractéristiques Du Produit Connexes:
  • Intelligent zero reference point technology ensures accurate height measurement.
  • Detects solder bridging, solder breakage, and icicles effectively.
  • Works efficiently with PCBs of different color variations.
  • Automatic solder pad compensation enhances height and volume measurement accuracy.
  • SPC data analysis aids in improving process quality.
  • Three Point Checks software quickly identifies root causes of solder paste issues.
Les questions:
  • What is the primary function of the MagicRay 3D SPI-VSP3000 Series?
    The MagicRay 3D SPI-VSP3000 Series is designed for 3D solder paste inspection after SMT screen printing, ensuring precision and quality in PCB manufacturing.
  • How does the system ensure accurate measurements?
    It uses intelligent zero reference point technology and automatic solder pad compensation to enhance the accuracy of height and volume measurements.
  • Can the MagicRay 3D SPI-VSP3000 Series detect PCB color variations?
    Yes, the system is effective in detecting PCBs with different color variations, ensuring reliable inspection results.
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